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BizEsp has won a prestigious funding award to build production lines using its unique patented technology for manufacturing ultra fine BGA (ufBGA) spheres for chip level packaging. The ufBGA spheres have diametres down to 75 microns. This is an enabling technology for further miniaturisation of Integrated Circuit (IC) packages.

Oxford, UK (PRWEB) August 9, 2008 — BizEsp Limited, the high technology electronics materials specialist company based in the international technology hub of Oxford, England - announced today the launch of a new project to develop high tech production equipment for the manufacture of ufBGA spheres of diameters down to 75 microns. Spheres down to this fine size are currently commercially not available anywhere the world. The technology is needed to enable further miniaturisation of IC packages. The underlying technology has been developed by BizEsp engineers working in the Company’s engineering centre in Oxford, UK and the Company has already filed a patent application on its invention. The project is being part funded by the UK government’s South East England Development Agency (SEEDA) after BizEsp won a funding award against UK wide competition.

Announcing the project launch, CEO Dr Dosten Baluch said “we are delighted to have won UK government support for our technology. These are competitive grants which means they are subject to open competition by UK companies. It is, therefore, an excellent achievement by BizEsp to have won this funding and is an endorsement of our technology and its value to the UK. We are doing this project because BizEsp market research identified a strong “technology pull” in the microelectronics interconnect market for BGA solder spheres of diameter less than 200 microns, driven by relentless consumer demand for miniaturisation of electronics combined with ever increasing functionality of equipment for example cell phones that also function as audio/visual entertainment devices whilst offering multiple mobile communications functionalities. This needs substantial increases in integrated circuit miniaturization, processor speed and circuit density and, as a result, traditional wired or leaded electronics interconnect technology has already been stretched to its limits. Our ufBGA technology fulfils this important need and when combined with appropriate placement technologies, will enable electronics manufacturers to continue to increase miniaturisation whilst simultaneously achieving higher and higher equipment functions”.

Ball Grid Array (BGA) technology simultaneously addresses the need for high density electrical interconnection and physical attachment of silicon chip devices. It employs a 2-D array of miniature solder alloy spheres under the silicon chip to provide both electrical connection and mechanical attachment to a mounting socket or circuit board. Currently, the smallest BGA spheres available on the market have diameters in the range 200 to 300 microns. BizEsp already has this type of technology to make BGA spheres in diameters 200 microns upwards (for further details of our standard BGA technology, interested readers are requested to contact BizEsp in Oxford, UK).

After completion of the current project (scheduled for Q2/2009), BizEsp will be offering spheres in diameters of 75 to 200 microns. Key process innovations mean that BizEsp’s customers will get product from a production process that will be highly stable with high yields and quality combined with great batch-to-batch consistency. For customers, this means that they will have a product giving high reliability of their electronics, process stability and great batch-to-batch consistency in their interconnect operations.

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[Via PRWeb: Technology Electronics]